Lead Frames Bopp film interleaf Solutions
Bopp film interleaf Film
Lead frames are used in almost all semiconductor packages. There are 2 kinds of technology for lead frames manufacture which is Stamping and Photo Etching. Photo etching is suitable for low to medium volume production, and stamping is for high volume production runs.
When stamping lead frames, geometric complexity and the requirement for extremely exacting tolerances adds cost, whether in low, medium, or high volume applications.
Rollstock Bopp interleaf Film
1.Our non migration tailor made Bopp film
property is ideal for lead frames delicate parts are free from being scratch defects against the BOPP film roll when rewind the Bopp interleaf process.
2.Stamping line could eliminates the housekeeping problem of paper core all over the floor by using our Bopp film with 3 inches ABS core.